Glass Wafer · TGV SubstratesCore Materials for Chip Packaging
From precision glass wafer processing to TGV substrates, SEMI-compliant and built for 5G/6G RF modules, AI packaging (CoWoS/HBM), and MEMS sensors — with one-stop optical coating included.
Glass Wafer · TGV SubstratesCore Materials for Chip Packaging
From precision glass wafer processing to TGV substrates, SEMI-compliant and built for 5G/6G RF modules, AI packaging (CoWoS/HBM), and MEMS sensors — with one-stop optical coating included.
TGV Glass Substrates
Next-Generation Packaging Interconnects
Through Glass Via (TGV) replaces traditional silicon substrates with low-loss glass, delivering superior electrical insulation, lower dielectric loss, and higher integration density. As demand surges for 5G mmWave, AI high-performance computing packaging, and MEMS sensors, TGV is becoming an essential material for advanced packaging.
- Via Diameter
- 30 – 150 μm
- Via Pitch
- 50 – 500 μm
- Substrate Thickness
- 0.1 – 0.7 mm
- Dielectric Constant (1GHz)
- < 6
- CTE
- 3 – 7 ppm/°C
- Key Applications
- 5G/6G · AI Packaging · MEMS
TGV Glass Substrates
Next-Generation Packaging Interconnects
Through Glass Via (TGV) replaces traditional silicon substrates with low-loss glass, delivering superior electrical insulation, lower dielectric loss, and higher integration density. As demand surges for 5G mmWave, AI high-performance computing packaging, and MEMS sensors, TGV is becoming an essential material for advanced packaging.
- Via Diameter
- 30 – 150 μm
- Via Pitch
- 50 – 500 μm
- Substrate Thickness
- 0.1 – 0.7 mm
- Dielectric Constant (1GHz)
- < 6
- CTE
- 3 – 7 ppm/°C
- Key Applications
- 5G/6G · AI Packaging · MEMS
Where It's Used
From advanced semiconductor packaging to precision optical instruments, supporting a wide range of high-tech manufacturing needs.
5G/6G · AI Advanced Packaging
TGV substrates are used in 5G mmWave RF front-end modules (RFFE), CoWoS packaging for AI accelerators, and high-bandwidth memory (HBM), meeting the demands of high-density interconnects and low-loss transmission — a key material for AI computing infrastructure.
MEMS · Precision Optics · Medical & Aerospace
Precision glass wafers are widely used in MEMS pressure sensors, gyroscopes, camera lens optical components, medical diagnostic instruments, and aerospace sensing systems — maintaining high reliability even under extreme heat, pressure, and vibration.
Where It's Used
From advanced semiconductor packaging to precision optical instruments, supporting a wide range of high-tech manufacturing needs.
5G/6G · AI Advanced Packaging
TGV substrates are used in 5G mmWave RF front-end modules (RFFE), CoWoS packaging for AI accelerators, and high-bandwidth memory (HBM), meeting the demands of high-density interconnects and low-loss transmission — a key material for AI computing infrastructure.
MEMS · Precision Optics · Medical & Aerospace
Precision glass wafers are widely used in MEMS pressure sensors, gyroscopes, camera lens optical components, medical diagnostic instruments, and aerospace sensing systems — maintaining high reliability even under extreme heat, pressure, and vibration.
Specialty Optical Glass Processing
Custom processing services for Carrier Glass, piezoelectric materials, Blue Glass, and a wide range of optical glass types.
Carrier Glass
Glass Carrier Wafer for Thin Wafer Handling
Supports ultra-thin wafers (≤150μm) during thinning, coating, and etching processes to prevent breakage — cleanable and reusable afterward to reduce production costs.
- Available Sizes
- 6" / 8" / 12"
- Material
- Fused Silica / BF33
- Thickness
- 500μm – 775μm
- TTV
- ≤1μm (premium) / ≤2μm
- Surface
- DSP double-side polished, Ra ≤0.5nm
- Heat Resistance
- Fused Silica >1000°C
Piezoelectric Components
Piezoelectric Material
Made from synthetic quartz and available in plano, plano-convex, and bi-convex cut forms, suitable for high-reliability applications in aerospace, telecom base stations, and satellites.
- Material
- Synthetic Quartz
- Size
- φ4.5–φ14mm / 1.8×3–30×30mm
- Frequency
- 5MHz (O3) – 120MHz (O5)
- Cut Type
- Plano / Plano-convex / Bi-convex / Doubly rotated cut
Blue Glass (IR Cut Filter)
IR Absorbing Filter / Blue Glass
Blocks infrared light above 700nm to ensure accurate color reproduction on CMOS sensors, widely used in smartphone camera modules, automotive lenses, and security surveillance.
- Material
- SCHOTT BG / CDGM QB / NEG
- Size
- 77×77mm (standard)
- Thickness
- 0.11 / 0.145 / 0.21 / 0.3mm
- Cutoff Wavelength
- >700nm IR blocking
Other Optical Glass
Other Optical Glasses
Precision cutting, grinding, and polishing services for optical glass from multiple leading brands, covering applications from camera lenses to medical instruments.
- SCHOTT B270 / D263T
- High-transmission optics
- JGS1 (Fused Silica)
- UV optics
- OHARA Series
- Camera, medical
- CORNING Eagle XG
- TFT-LCD substrates
- Size
- φ8–φ400mm
- Thickness
- 0.07–15.0mm
Specialty Optical Glass Processing
Custom processing services for Carrier Glass, piezoelectric materials, Blue Glass, and a wide range of optical glass types.
Carrier Glass
Glass Carrier Wafer for Thin Wafer Handling
Supports ultra-thin wafers (≤150μm) during thinning, coating, and etching processes to prevent breakage — cleanable and reusable afterward to reduce production costs.
- Available Sizes
- 6" / 8" / 12"
- Material
- Fused Silica / BF33
- Thickness
- 500μm – 775μm
- TTV
- ≤1μm (premium) / ≤2μm
- Surface
- DSP double-side polished, Ra ≤0.5nm
- Heat Resistance
- Fused Silica >1000°C
Piezoelectric Components
Piezoelectric Material
Made from synthetic quartz and available in plano, plano-convex, and bi-convex cut forms, suitable for high-reliability applications in aerospace, telecom base stations, and satellites.
- Material
- Synthetic Quartz
- Size
- φ4.5–φ14mm / 1.8×3–30×30mm
- Frequency
- 5MHz (O3) – 120MHz (O5)
- Cut Type
- Plano / Plano-convex / Bi-convex / Doubly rotated cut
Blue Glass (IR Cut Filter)
IR Absorbing Filter / Blue Glass
Blocks infrared light above 700nm to ensure accurate color reproduction on CMOS sensors, widely used in smartphone camera modules, automotive lenses, and security surveillance.
- Material
- SCHOTT BG / CDGM QB / NEG
- Size
- 77×77mm (standard)
- Thickness
- 0.11 / 0.145 / 0.21 / 0.3mm
- Cutoff Wavelength
- >700nm IR blocking
Other Optical Glass
Other Optical Glasses
Precision cutting, grinding, and polishing services for optical glass from multiple leading brands, covering applications from camera lenses to medical instruments.
- SCHOTT B270 / D263T
- High-transmission optics
- JGS1 (Fused Silica)
- UV optics
- OHARA Series
- Camera, medical
- CORNING Eagle XG
- TFT-LCD substrates
- Size
- φ8–φ400mm
- Thickness
- 0.07–15.0mm
Quality Inspection Equipment
Equipped with professional optical measurement instruments to ensure every glass substrate meets the strictest quality standards in the semiconductor and optics industries.
TTV (Total Thickness Variation) Measurement
Zygo Interferometer
- Measurement Item
- Total Thickness Variation
- Precision
- 0.1 μm
- Max Size
- D300mm
Flatness Measurement (Warp / Bow)
Interferometer
- Measurement Item
- Warp / Bow
- Precision
- 0.1 μm
- Max Size
- D300mm
Surface Roughness Measurement
Veeco White Light Interferometer
- Measurement Item
- Ra surface roughness
- Precision
- 0.01 μm
- Spec Standard
- Ra ≤ 0.5nm
Particle & Dust Inspection
Optical Particle Counter
- Measurement Item
- Surface particle size
- Precision
- 0.1 μm
- Applicable To
- Glass Wafer / Carrier Glass
Quality Inspection Equipment
Equipped with professional optical measurement instruments to ensure every glass substrate meets the strictest quality standards in the semiconductor and optics industries.
TTV (Total Thickness Variation) Measurement
Zygo Interferometer
- Measurement Item
- Total Thickness Variation
- Precision
- 0.1 μm
- Max Size
- D300mm
Flatness Measurement (Warp / Bow)
Interferometer
- Measurement Item
- Warp / Bow
- Precision
- 0.1 μm
- Max Size
- D300mm
Surface Roughness Measurement
Veeco White Light Interferometer
- Measurement Item
- Ra surface roughness
- Precision
- 0.01 μm
- Spec Standard
- Ra ≤ 0.5nm
Particle & Dust Inspection
Optical Particle Counter
- Measurement Item
- Surface particle size
- Precision
- 0.1 μm
- Applicable To
- Glass Wafer / Carrier Glass